TIM (Thermal Conductive Material)
반도체 Package, 정전척(Electrostatic chuck) 및 Battery 등
다양한 용도에 필요한 방열 Solution으로 우수한 접착력과 고내열 특성을 가진 TIM(Thermal Interface Material)을 제공하고 있습니다.
Feasibilities
-
Good flowability
(Electrostatic) -
Excellent adhesion
-
Good workability
-
High heat resistance
-
Hight reliability
Applications
Properties
|
제품명
Product Name |
경화조건
Cure Schedule |
점도(cPs@5rpm)
Viscosity |
TI |
Hardness
Shore A |
열전도도(mW/K)
Thermal Conductivity |
용도
Application |
비고
Remark |
|---|---|---|---|---|---|---|---|
| JC2002 | 130℃/3hr | 3,500±1,000 | 1.0±0.2 | 50 | 0.2 | Electrostatic Chuck | |
| JC2004 | 130℃/3hr | 4,500±1,000 | 1.0±0.2 | 55 | 0.4 | Electrostatic Chuck | |
| JC2010 | 130℃/3hr | 13,000±5,000 | 1.0±0.2 | 80 | 1 | Electrostatic Chuck | |
| JC2015 | 130℃/3hr | 6,500±1,000 | 1.0±0.2 | 40 | 1.5 | Electrostatic Chuck | |
| JC2021 | 130℃/3hr | 15,000±5,000 | 1.0±0.5 | 88 | 2.1 | Electrostatic Chuck | |
| JC2027 | 130℃/3hr | 43,000±10,000 | 1.2±0.3 | 88 | 2.7 | Electrostatic Chuck | |
| JA2027 | 150℃/1hr | 32,000±8,000 | 2.5±0.5 | 85 | 2.7 | TIM | |
| JA2020 | 150℃/1hr | 28,000±8,000 | 2.5±0.5 | 85 | 2 | TIM | |
| JA2050 | 150℃/1hr | 25,000~35,000 | 2.0~3.0 | 85 | >5.0 | TIM | 개발 중 (Under developing) |